Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation

Discrete function integration is achieved at the package level with a variety of packaging solutions, mainly package on package. In this paper we review mainstream package on package technology offerings and compare them against improved versions of these packages where advances in materials propert...

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Detalles Bibliográficos
Autor Principal: Roa Vargas, Fernando
Formato: Artículo (Article)
Lenguaje:Desconocido (Unknown)
Publicado: 2013
Acceso en línea:

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