Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation

Discrete function integration is achieved at the package level with a variety of packaging solutions, mainly package on package. In this paper we review mainstream package on package technology offerings and compare them against improved versions of these packages where advances in materials propert...

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Autor Principal: Roa Vargas, Fernando
Formato: Artículo (Article)
Lenguaje:Desconocido (Unknown)
Publicado: 2013
Materias:
Acceso en línea:http://babel.banrepcultural.org/cdm/ref/collection/p17054coll23/id/682
id ir-p17054coll23-682
recordtype dspace
spelling ir-p17054coll23-6822020-09-29 Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation Roa Vargas, Fernando Discrete function integration is achieved at the package level with a variety of packaging solutions, mainly package on package. In this paper we review mainstream package on package technology offerings and compare them against improved versions of these packages where advances in materials properties and processing techniques are leveraged to meet increasingly tighter overall package thickness requirements while maintaining or improving the reliability, yield and cost effectiveness metrics set by the existing technologies. Different avenues to achieve very thin POP and system-in-a-package constructions are explored in detail, showing the implications in terms of material properties, new or improved processing steps and design trade-offs. Similarly, we show examples where these new techniques have been used successfully to achieve the stricter thickness targets and to prove that these technologies are ready to be applied and leveraged immediately for functionality integration without requiring extended development times or completely new processing methodologies. Electronic components; Microelectronics packaging; Print circuit manufacture Tecnología; Tecnología / Ingeniería y operaciones afines 2013 PDF Artículo ENG - Inglés Colfuturo © Derechos reservados del autor http://babel.banrepcultural.org/cdm/ref/collection/p17054coll23/id/682
institution Biblioteca Virtual Banco de la República - Colecciones digitales
collection Custom
language Desconocido (Unknown)
topic Electronic components; Microelectronics packaging; Print circuit manufacture
Tecnología; Tecnología / Ingeniería y operaciones afines
spellingShingle Electronic components; Microelectronics packaging; Print circuit manufacture
Tecnología; Tecnología / Ingeniería y operaciones afines
Roa Vargas, Fernando
Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation
description Discrete function integration is achieved at the package level with a variety of packaging solutions, mainly package on package. In this paper we review mainstream package on package technology offerings and compare them against improved versions of these packages where advances in materials properties and processing techniques are leveraged to meet increasingly tighter overall package thickness requirements while maintaining or improving the reliability, yield and cost effectiveness metrics set by the existing technologies. Different avenues to achieve very thin POP and system-in-a-package constructions are explored in detail, showing the implications in terms of material properties, new or improved processing steps and design trade-offs. Similarly, we show examples where these new techniques have been used successfully to achieve the stricter thickness targets and to prove that these technologies are ready to be applied and leveraged immediately for functionality integration without requiring extended development times or completely new processing methodologies.
format Artículo (Article)
author Roa Vargas, Fernando
author_facet Roa Vargas, Fernando
author_sort Roa Vargas, Fernando
title Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation
title_short Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation
title_full Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation
title_fullStr Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation
title_full_unstemmed Very thin POP and SIP packaging approaches to achieve functionality integration prior To TSV implementation
title_sort very thin pop and sip packaging approaches to achieve functionality integration prior to tsv implementation
publishDate 2013
url http://babel.banrepcultural.org/cdm/ref/collection/p17054coll23/id/682
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score 11,489418