Fine pitch copper pillar interconnection with C4 (mass reflow) processing

Flip chip interconnection design and process capability has been extended with the use of copper pillar, specially for finer pitches, beyond what was possible with area array and standard C4 reflow and solder bumps. Many trends in device packaging are fueling this trend, specially the needs for thin...

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Detalles Bibliográficos
Autor Principal: Roa Vargas, Fernando
Formato: Artículo (Article)
Lenguaje:Desconocido (Unknown)
Publicado: 2014
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